发明名称 |
Optical package substrate, optical device, optical module, and method for molding optical package substrate |
摘要 |
Micro-discharge machining is employed to obtain a die, and an optical package substrate is produced by press formation using such a die. An optical fiber, an optical waveguide, a lens, an isolator, an optical filter and a light receiving/emitting element are mounted by passive alignment.
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申请公布号 |
US6904190(B2) |
申请公布日期 |
2005.06.07 |
申请号 |
US20020308007 |
申请日期 |
2002.12.03 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KORENAGA TSUGUHIRO;ITOH NOBUKI;TOJO MASAAKI;WADA TOSHIHIKO |
分类号 |
G02B6/26;G02B6/34;G02B6/42;(IPC1-7):G02B6/12 |
主分类号 |
G02B6/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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