发明名称 |
Substrate-embedded capacitor, production method thereof, and circuit board |
摘要 |
A capacitor is embedded in a substrate having a small thickness where only a small space for short connection lines is required. The substrate-embedded capacitor includes a substrate having an opening, a first conductive layer on the substrate, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and an insulating layer formed on the second conductive layer and having an opening. In the substrate-embedded capacitor, the first conductive layer and the second conductive layer are exposed through the openings in the substrate and the insulating layer, respectively.
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申请公布号 |
US6903917(B2) |
申请公布日期 |
2005.06.07 |
申请号 |
US20030453311 |
申请日期 |
2003.06.03 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HIGASHI MITSUTOSHI;SAKAGUCHI HIDEAKI;KOIKE HIROKO |
分类号 |
H01L27/04;H01G2/06;H01G4/06;H01G4/228;H01G4/33;H01G4/35;H01L21/00;H01L21/02;H01L21/20;H01L21/822;H01L21/8242;H01L27/08;(IPC1-7):H01G4/228 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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