发明名称 Substrate-embedded capacitor, production method thereof, and circuit board
摘要 A capacitor is embedded in a substrate having a small thickness where only a small space for short connection lines is required. The substrate-embedded capacitor includes a substrate having an opening, a first conductive layer on the substrate, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and an insulating layer formed on the second conductive layer and having an opening. In the substrate-embedded capacitor, the first conductive layer and the second conductive layer are exposed through the openings in the substrate and the insulating layer, respectively.
申请公布号 US6903917(B2) 申请公布日期 2005.06.07
申请号 US20030453311 申请日期 2003.06.03
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 HIGASHI MITSUTOSHI;SAKAGUCHI HIDEAKI;KOIKE HIROKO
分类号 H01L27/04;H01G2/06;H01G4/06;H01G4/228;H01G4/33;H01G4/35;H01L21/00;H01L21/02;H01L21/20;H01L21/822;H01L21/8242;H01L27/08;(IPC1-7):H01G4/228 主分类号 H01L27/04
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