| 摘要 |
A trench capacitor process for preventing parasitic leakage. The process is capable of blocking leakage current from a parasitic transistor adjacent to the trench, and includes the steps of forming a doping layer and a cap layer covering portions of the sidewall of the trench and performing an annealing process on the doping layer to form a dopant region in the substrate adjacent to each sidewall of the trench and blocks leakage current from a parasitic transistor adjacent to the trench.
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