| 摘要 |
In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) ( 17 ) operates at a high speed in using at a high frequency band, and a predetermined number of terminals ( 19 ) are provided with a high frequency current suppressor ( 21 ) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor ( 21 ) is a thin film magnetic substance having a range from 0.3 to 20 (mum) in thickness, and is disposed on the entire surface of each terminal ( 19 ), covering a mounting portion to be mounted on a printed wiring circuit board ( 23 ) for mounting IC ( 17 ) and an edge including a connecting portion to a conductive pattern ( 25 ) disposed on the printed wiring circuit board ( 23 ). When the top end is connected with the conductive pattern ( 25 ) by means of a solder ( 27 ) in mounting the printed wiring circuit board ( 23 ) of IC ( 17 ), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.
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