发明名称 |
Method of polishing a semiconductor device |
摘要 |
The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.
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申请公布号 |
US6903021(B2) |
申请公布日期 |
2005.06.07 |
申请号 |
US20040850083 |
申请日期 |
2004.05.19 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
REINHARDT HEINZ F.;ROBERTS JOHN V. H.;MCCLAIN HARRY GEORGE;BUDINGER WILLIAM D.;JENSEN ELMER WILLIAM |
分类号 |
B05D5/00;B05D7/02;B24B37/04;B24B37/26;B24B53/00;B24B53/007;B24B53/017;B24D3/28;B24D3/32;B29C70/58;B29C70/66;C08J5/14;H01L21/304;H01L21/306;H01L21/3105;(IPC1-7):H01L21/302 |
主分类号 |
B05D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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