| 摘要 |
A method and system for improved material processing using a laser beam. The method and system includes directing a laser beam above, at or below the surface of the material in one or more preferred patterns and with preferred laser pulse characteristics specific to the material to reduce or mitigate the accumulation or effects of gas, debris, fluid, or other by-products of photodisruption either at the location where additional laser pulses are being placed or in other sensitive locations in the material.
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