发明名称 Method and apparatus for reducing substrate edge effects in electron lenses
摘要 One embodiment disclosed pertains to a method for inspecting a substrate. The method includes inserting the substrate into a holding place of a substrate holder, moving the substrate holder under an electron beam, and applying a voltage to a conductive element of the substrate holder. The voltage applied to the conductive element reduces a substrate edge effect. Another embodiment disclosed relates to an apparatus for holding a substrate that reduces a substrate edge effect. The apparatus includes a holding place for insertion of the substrate and a conductive element. The conductive element is positioned so as to be located within a gap between an edge of the holding place and an edge of the substrate.
申请公布号 US6903338(B2) 申请公布日期 2005.06.07
申请号 US20030600050 申请日期 2003.06.20
申请人 KLA-TENCOR TECHNOLOGIES CORPORATION 发明人 MANKOS MARIAN;ADLER DAVID L.
分类号 H01L21/66;G01N23/203;G01Q30/02;G01Q30/20;G21K7/00;H01J37/20;H01J37/244;H01J37/28;(IPC1-7):G21K7/00 主分类号 H01L21/66
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