发明名称 |
Method and apparatus for reducing substrate edge effects in electron lenses |
摘要 |
One embodiment disclosed pertains to a method for inspecting a substrate. The method includes inserting the substrate into a holding place of a substrate holder, moving the substrate holder under an electron beam, and applying a voltage to a conductive element of the substrate holder. The voltage applied to the conductive element reduces a substrate edge effect. Another embodiment disclosed relates to an apparatus for holding a substrate that reduces a substrate edge effect. The apparatus includes a holding place for insertion of the substrate and a conductive element. The conductive element is positioned so as to be located within a gap between an edge of the holding place and an edge of the substrate.
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申请公布号 |
US6903338(B2) |
申请公布日期 |
2005.06.07 |
申请号 |
US20030600050 |
申请日期 |
2003.06.20 |
申请人 |
KLA-TENCOR TECHNOLOGIES CORPORATION |
发明人 |
MANKOS MARIAN;ADLER DAVID L. |
分类号 |
H01L21/66;G01N23/203;G01Q30/02;G01Q30/20;G21K7/00;H01J37/20;H01J37/244;H01J37/28;(IPC1-7):G21K7/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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