| 摘要 |
There is provided a supporting plate having a structure in which a solvent can be supplied to an adhesive layer between the supporting plate and a substrate such as a semiconductor wafer in a short period of time after the substrate is thinned, and also a method for stripping the supporting plate. The supporting plate may have a larger diameter than the semiconductor wafer, and penetrating holes are formed in the supporting plate. The outer peripheral portion of the supporting plate is a flat portion in which no penetrating hole is formed. When alcohol is poured from above the supporting plate, the alcohol reaches the adhesive layer through the penetrating holes, dissolves and removes the adhesive layer. |
