| 摘要 |
The present invention discloses a physical shelf architecture for high density metallic cross connect systems. The present invention is intended to overcome the problems associated with the physical interconnections of metallic paths in cross connect switching systems. The physical architecture of the present invention effectively performs physical interconnections required by high density metallic cross connect systems. The physical architecture enables for a scalable design and structure of racks and shelves. In particular, inter-connect levels can be performed with devices-to-devices, boards-to-boards, shelves-to-shelves, and racks-to-racks.
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