Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly.

摘要

PROBLEM TO BE SOLVED: To provide an IC chip suffering no damage to a chip main body when actually installed, a head suspension assembly provided with the IC chip, and the manufacturing method of the IC chip and the head suspension assembly. SOLUTION: In an IC chip equipped with a circuit for a thin-film magnetic head element, a protective layer is formed on at least part of a surface (rear surface) opposite a surface having a connection electrode formed thereon.