发明名称 FORMING METHOD OF THIN FILM FOR EVALUATION, AND THE EVALUATION METHOD OF ELECTRON DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a forming method of a film for evaluation in which a dependence evaluation against the film thickness of the property of a functional film can be carried out easily and effectively, by applying a combinatorial process, in particular, in forming the functional film by a liquid phase method, and provide an evaluation method of an electron device using this forming method. SOLUTION: This is the forming method of the film for evaluation in order to evaluate the dependence on the film thickness of the characteristics of the functional film. This is provided with a forming process of a liquid film 2 in which a liquid body is arranged on a substrate 1, and a forming process in which the substrate 1 is arranged in a vacuum device 3, an air current is made to be formed on the surface of the liquid film 2 by flowing gas into the vacuum device during evacuating inside of the vacuum device 3, and by this the liquid film 2 is dried and the film for the evaluation with the difference of film thickness in the air current direction is formed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005141971(A) 申请公布日期 2005.06.02
申请号 JP20030375585 申请日期 2003.11.05
申请人 SEIKO EPSON CORP 发明人 TAKASHIMA TAKESHI;OSONO ATSUSHI;MORII KATSUYUKI
分类号 H05B33/10;B05D3/12;H01L51/50;H05B33/14;(IPC1-7):H05B33/10 主分类号 H05B33/10
代理机构 代理人
主权项
地址