| 摘要 |
PROBLEM TO BE SOLVED: To stably secure sufficient electrostatic resisting pressure between a metal hermetic seal and Si chip, in a pressure sensor of a composition having bonded Si chip on the metal hermetic seal, even when it is used under single-sided air opening, such as a manometer. SOLUTION: The pressure sensor comprises the silicon (Si) chip, with which a diaphragm for detecting pressure is formed, and the metal hermetic seal with which a connecting hole is formed, directly jointing them by using an adhesive bond. On the surface by the side of the metal hermetic seal, where the Si chip is pasted, a part (mesa) of convex form is provided. A bonded part of the Si chip and the metal hermetic seal is pasted so that all the circumference of convex form of mesa is covered with the adhesive bond of more than prescribed thickness. The pressure sensor is formed, in such a way that the mesa is located according to the position, in which the optimal connecting path to the diaphragm is formed at the forming of the adhesive-bonded layer. COPYRIGHT: (C)2005,JPO&NCIPI
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