发明名称 Communication semiconductor integrated circuit device and wireless communication system
摘要 A communication semiconductor integrated circuit device includes an RFVCO and a TXVCO and is formed over one semiconductor substrate, and has a first operation mode (idle mode) which does not perform transmission and reception, a second operation mode (warmup mode) which performs a preparation prior to the start of transmission or reception, and a third operation mode (transmission or reception mode) which performs transmission or reception. In the first operation mode, two oscillators are deactivated, and the operation of selecting a frequency band to be used in at least the TXVCO which generates a transmit signal, is performed in the second operation mode. In the communication semiconductor integrated circuit device, a high frequency signal generator which generates a signal having a desired frequency with an oscillation signal outputted from a crystal oscillator as a reference signal, a reception system circuit (RXC) including a frequency converter, and a transmission system circuit (TXC) including the TXVCO which generates the transmit signal, are respectively formed in different semiconductor regions isolated by insulators.
申请公布号 US2005116781(A1) 申请公布日期 2005.06.02
申请号 US20040994280 申请日期 2004.11.23
申请人 YAMAMOTO SATORU;OOSAWA HIROTAKA;UOZUMI TOSHIYA;KURAKAMI NORIYUKI;SHINBO JIRO 发明人 YAMAMOTO SATORU;OOSAWA HIROTAKA;UOZUMI TOSHIYA;KURAKAMI NORIYUKI;SHINBO JIRO
分类号 H03L7/187;H03L7/00;H03L7/08;H03L7/099;H03L7/10;H03L7/193;H03L7/199;H04B1/40;(IPC1-7):H03L7/00 主分类号 H03L7/187
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