发明名称 Component mounting apparatus
摘要 A component mounting apparatus is proposed, which has a plurality of vacuum pick-up nozzles attached to a mount head so as to revolve about a main shaft, causing one of the vacuum pick-up nozzles to move to a location to be driven by an actuator that is provided at a designated location in the direction of revolution, and causing the vacuum pick-up nozzle to make a forward movement by the actuator for vacuum pick-up and/or mounting of a component, wherein each of the vacuum pick-up nozzles is provided with a pushed plate of a designated size in the moving direction of the vacuum pick-up nozzle at a driven portion thereof.
申请公布号 US2005115063(A1) 申请公布日期 2005.06.02
申请号 US20040981790 申请日期 2004.11.05
申请人 SONY CORPORATION 发明人 SAITO ATSUSHI;KIMURA AKIRA
分类号 B23P19/00;B23P21/00;B65G47/91;H05K13/04;(IPC1-7):B23P19/00 主分类号 B23P19/00
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