发明名称 |
Elektronisches Bauteil mit einem Halbleiterchip und einer Umverdrahtungsplatte und Systemträger für mehrere elektronische Bauteile sowie Verfahren zur Herstellung derselben |
摘要 |
The invention relates to an electronic device and a leadframe and to methods for producing the electronic device and the leadframe. The electronic device has a semiconductor chip with a top side fixed on a rewiring plate by a double-sided adhesive film. The underside of the rewiring plate has an edge region with through openings. The through openings are filled with a plastics compound that holds together the semiconductor chip and the rewiring plate by acting as a mechanical clip. |
申请公布号 |
DE10162676(B4) |
申请公布日期 |
2005.06.02 |
申请号 |
DE2001162676 |
申请日期 |
2001.12.19 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
ZACHERL, JUERGEN;REIS, MARTIN |
分类号 |
H01L23/13;H01L23/31;H01L23/498 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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