| 摘要 |
The package has two chips (Chipl, Chip2) with power generators (DG1, DG2), selecting circuits (OL1, OL2) and internal circuits (Cl, C2). The power circuits supply power to the internal circuits, respectively. The selecting circuits enable/disable the power circuits, respectively. The circuit (OL1) sends a disable control signal to the circuit (DG1) when a ground voltage is connected to an input of the circuit (OL1). An independent claim is also included for a method of reducing current consumption in a semiconductor package. |
