| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a slurry composition capable of applying chemical mechanical polishing to a metal such as Cu with a high efficiency without causing scratch and dishing to the metal, and to provide a method for chemical mechanical polishing. <P>SOLUTION: Resin particles or composite particles resulting from composing resin particles with inorganic particles and a chelating agent are contained in the chemical mechanical polishing slurry composition to form composite particles, by allowing the soft resin particles to hold the hard inorganic particles and acting the resin particles like a buffer member to avoid the occurrence of scratch. Further, the addition of the chelating agent forms a fragile metal complex on the surface of the metal to enhance the polishing speed. Moreover, in the chemical mechanical polishing, polishing pressure is exerted to the resin or composite particles for deforming the particles to cause a friction force to a border between the particles and an object to be polished, thereby polishing the object to be polished. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
