STAIR STEP PRINTED CIRCUIT BOARD STRUCTURES FOR HIGH SPEED SIGNAL TRANSMISSIONS
摘要
Disclosed are stair stepped PCB structures which provide high performance, direct path, via-less interconnections between various elements of an electronic interconnection structure including, among others, IC packages and connectors.
申请公布号
WO2005050708(A2)
申请公布日期
2005.06.02
申请号
WO2004US38286
申请日期
2004.11.15
申请人
SILICON PIPE, INC.;GRUNDY, KEVIN, P.;WIEDEMANN, WILLIAM, F.;FJELSTAD, JOSEPH, C.
发明人
GRUNDY, KEVIN, P.;WIEDEMANN, WILLIAM, F.;FJELSTAD, JOSEPH, C.
