METHOD OF FORMING HOLE IN COPPER-CLAD BOARD BY LASER

摘要

PROBLEM TO BE SOLVED: To provide a method of forming holes in a copper-clad board by a laser which can prevent the contamination of a surface-layer copper foil by the scattering of processing waste and can form holes having a good shape with little variation in diameters.

SOLUTION: A double-sided copper-clad board has at least two copper layers of the 3-12μm thick surface-layer copper foil. The surface-layer copper foil is partially dissolved and removed in the thickness direction with a chemical to make the thickness of the copper foil 1-10μm. On the surface of the copper clad board thus treated, an assistant material for boring is arranged. By directly irradiating a laser on the surface, holes are formed in the treated copper clad board. By this method, the contamination of the surface-layer copper foil can be prevented, and holes having a good shape can be formed with little variation in diameters.

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