SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of easily performing relocation wiring in a three-dimensional chip lamination technique and of realizing high manufacturing efficiency with easy chip handling. SOLUTION: A semiconductor device is formed through a laminating process of bonding intermediate chip modules 50 and semiconductor chips 41 respectively to each other using an intermediate chip 1 electrically connectable between the semiconductor chips 41, and including the intermediate chip 1 and the semiconductor chips 41. COPYRIGHT: (C)2005,JPO&NCIPI