| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for TAB which can be improved in dimensional accuracy and positional accuracy at transporting, mounting, and bonding and, in addition, with which inner leads can be wired at high density while the weight and thickness of the carrier are reduced. SOLUTION: On the surface of an insulating layer 2, a conductor pattern 7 composed of a plurality of wiring 8 containing inner leads 9 arranged in pitches of≤60μm and arranged at prescribed intervals is formed. On the rear surface of the insulating layer 2, reinforcing layers 4 composed of stainless steel foil are formed along the lengthwise direction of the insulating layer 2 on both end edges of the rear surface of the layer 2 in the widthwise direction. In addition, a mounting area 6 for mounting an electronic component is provided on the surface of the insulating layer 2 and the inner leads 9 are disposed on the insulating layer 2 in the mounting area 6. COPYRIGHT: (C)2005,JPO&NCIPI
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