MULTILAYER PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board capable of forming a joint with a high reliability according to a simple process and improving a productivity, and to provide a method of manufacturing the printed-circuit board. SOLUTION: The manufacturing method comprises the steps of: sticking a primary metal film 23 on a front surface of a central layer of a base material 20 via a variant film 22; forming a primary joint 27 so as to be electrically connected by performing electrolysis electrodepositing on this front surface; forming a joint 40 on which a secondary joint 37 is formed in a body on this front surface according to an electrolysis electrodepositing process; forming a secondary metal film 53 so as to be electrically connected with a front surface of the secondary joint 37; and etching a specific site of the secondary metal film 53 to form copper foil patterns. COPYRIGHT: (C)2005,JPO&NCIPI