| 摘要 |
A conductive sheet (1) according to the present invention includes: an insulating substrate (2) having at least one via hole (3), a ground conductive layer (5); and a top conductive layer (6), and characterized in that the via hole (3) is a fine pore penetrating through the insulating substrate (2), the ground conductive layer (5) is formed by a sputtering method or a vapor deposition method on all of a surface of the insulating substrate (2), the top conductive layer (6) is formed on all of or part of a surface of the ground conductive layer (5), and the via hole (3) is filled with the top conductive layer (6). |
