发明名称 Method of forming thin ruthenium-containing layer
摘要 A method of forming a thin ruthenium-containing layer includes performing a CVD process using butyl ruthenoscene as a ruthenium source material. The thin ruthenium-containing layer may be formed by a one-step or two-step CVD process. The one-step CVD process is performed under a constant oxygen flow rate and a constant deposition pressure. The two-step CVD process includes forming a seed layer and forming a main layer, each of which is performed under a different process condition of a deposition temperature, an oxygen flow rate, and a deposition pressure.
申请公布号 US2005118335(A1) 申请公布日期 2005.06.02
申请号 US20040014214 申请日期 2004.12.16
申请人 PARK SOON-YEON;YOO CHA-YOUNG;WON SEOK-JUN 发明人 PARK SOON-YEON;YOO CHA-YOUNG;WON SEOK-JUN
分类号 H01L21/205;C23C16/02;C23C16/18;C23C16/40;C23C16/44;C23C16/455;H01L21/02;H01L21/28;H01L21/285;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):C23C16/00 主分类号 H01L21/205
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