| 摘要 |
A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components ( 10 ) in an insulation layer ( 4 ) to increase the quantity of mounting electric components, has a high reliability, and undergoes a complicated manufacturing process, and a method for manufacturing the wiring board sheet A multilayer board which is manufactured from this wiring board sheet, eliminates a difference in thermal histories during molding in each layer, simplifies the manufacturing process, and realize miniaturization by the scale-down and high-density of a conductor circuit and an improvement in reliability, and a method for manufacturing the multilayer board.
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