发明名称 Assembly structure for hiding electronic components
摘要 The present invention is related to an assembly structure for hiding electronic components, that is, at least one containing hole penetrating through a PCB being set on a predetermined location of the PCB, circuits being arranged on at least one surface of a predetermined side edge of the containing hole, the containing hole being capable of reserving at least one electronic component (IC chip, resistance, capacitance or LED, etc.) so as to that at least one leg of the electronic component extending and connecting to the circuits of the surface for welding, the assembly structure for hiding electronic components is therefore formed.
申请公布号 US2005117314(A1) 申请公布日期 2005.06.02
申请号 US20040959167 申请日期 2004.10.07
申请人 OPTIMUM CARE INTERNATIONAL TECH. INC. 发明人 LIEN JEFFREY
分类号 H05K1/16;H05K1/18;H05K7/06;(IPC1-7):H05K7/06 主分类号 H05K1/16
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