| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin and inexpensive electronic circuit unit with reliable reflow solder. SOLUTION: In the surface-mounted electronic circuit unit, a circuit board 11 is attached so that a conductive pattern 15 is outside. Electric components 13 positioned inside a cover 1 are electrically shielded by the cover 1 and the conductive pattern 15. During reflow soldering since a hot air passes through an opening 6 of the bottom wall 2 and the tip of the leg 5 is soldered to a wiring pattern 12, the height of the cover can be greatly reduced in comparison with a conventional one, and thus, the circuit unit is made thin. In soldering the cover, the solder for electric components is not melted, and consequently, a reliable reflow solder is obtained. COPYRIGHT: (C)2004,JPO |
