发明名称 MULTI-LAYER CIRCUIT BOARD WITH BUILT-IN CAPACITOR ELEMENT AND MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To build a capacitor element having a capacity equal to the designed one in a multi-layer circuit board, regardless of the largeness of the lower electrode of the capacitor element. <P>SOLUTION: The multi-layer circuit board 25 with a built-in capacitor element includes first and second capacitor elements 23a, 23b in which lower electrodes 15a, 15b, a dielectric layer 18, upper electrodes 19a, 19b are laminated sequentially. The first and second capacitor elements include dummy patterns 22a, 22b, which are not connected with the lower electrode and are formed around the lower electrode. There is a relation of D1<D2 when S1>S2, and D1>D2 when S1<S2, where S1, S2 are each electrode area of the lower electrodes in the first and second capacitor elements, and D1, D2 are each area of dummy patterns of the first and second capacitor elements. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005142483(A) 申请公布日期 2005.06.02
申请号 JP20030379843 申请日期 2003.11.10
申请人 TOPPAN PRINTING CO LTD 发明人 SEKINE HIDEKATSU
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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