| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck having a heating mechanism assuming a novel structure and geometry whereby a wafer is heated to≥800°C without warpage. SOLUTION: An insulator-made cup-like shape having a flat section 13a and a side section 13b is formed, or a hat-like shape which is the cup-like shape provided with a skirt 13c extending outward from the lower end of the side 13b is formed, and this constitutes the electrostatic chuck main body 13 (13'). A chuck electrode 14 is provided on the surface side of the flat section 13a of the electrostatic chuck main body 13 (13'), and heater layers 15 and 19 are provided at the upper ends of the rear surface and of the outer surface of the side 13b, respectively. Power terminals are provided near the lower end of the side 13b of the electrostatic chuck main body 13 (13') for supplying power to the chuck electrode 14 and to the heater layers 15 and 19. Desired numbers of heat reflectors 18a and 18b are provided inside and outside the electrostatic chuck main body 13 (13'). COPYRIGHT: (C)2005,JPO&NCIPI |
