| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is excellent in adhesion to nickel plating, causes no problems of wire deformation, or the like, and exhibits excellent molding properties, and to provide a semiconductor device which suffers from no peeling at the back surface thereof after molding and after soldering treatment and is excellent in reliability. SOLUTION: The epoxy resin composition comprises as essential ingredients an epoxy resin, a phenolic resin, a specific imidazole curing accelerator, a specific silicone oil and crystalline silica. The semiconductor device is obtained by sealing a power transistor mounted on a plated lead frame using the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI |
