| 摘要 |
PROBLEM TO BE SOLVED: To accurately mount a semiconductor chip on a pad of a circuit substrate. SOLUTION: The printed circuit board has a surface-mounted component 4 wherein a plurality of bumps 10 are formed in a mounting surface 4a side, and a plurality of pads 3 wherein a guide projection 7 is formed in the outer circumferential side of the surface mounted component 4 deflected from the designed mounting position of the bump 10 corresponding to each bump 10 formed in the surface mounted component 4. It has a substrate 2 wherein the surface mounted component 4 is positioned and connected to a designed mounting position with the bump 10 of the surface mounted component 4 guided to a guide projection 7. COPYRIGHT: (C)2005,JPO&NCIPI
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