| 摘要 |
PROBLEM TO BE SOLVED: To provide a system of cleaning and drying a semiconductor substrate, and a method of cleaning and drying utilizing it. SOLUTION: The method improves yield of element by more efficiently controlling ratio of fluid for drying to fluid for cleaning, for example a ratio of nitrogen steam to IPA (isopropyl alcohol) steam, in such a way that in stages of offering a first and a second supplies of the fluid for drying, ratio of supply of the above-mentioned fluid for drying offered from the above-mentioned second supply comprises an independent stage with respect to ratio of supply of the above-mentioned fluid for drying offered from the above-mentioned first supply, and in a stage of storing fluid for decontamination supplied in a fluid tank, the fluid tank for the above-mentioned decontamination comprises a supply storage stage of the fluid for decontamination which has an inlet and an outlet accommodating the above-mentioned fluid for drying offered from the above-mentioned second supply, and a stage supplying the above-mentioned fluid for drying offered from the above-mentioned first supply and the above-mentioned fluid for decontamination to a processing chamber simultaneously so that smearing of a semiconductor wafer may be removed. COPYRIGHT: (C)2005,JPO&NCIPI
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