发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device includes a base interconnection substrate having an interconnect portion, an IC chip mounted on the base interconnection substrate, and a mold resin portion encapsulating the IC chip. The base interconnection substrate includes an electrode pad for external connection that is connected to the interconnect portion, and a reinforcing pad for preventing the base interconnection substrate from deforming in a transfer mold process. |
申请公布号 |
KR20050052424(A) |
申请公布日期 |
2005.06.02 |
申请号 |
KR20050031959 |
申请日期 |
2005.04.18 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
SHIKANO TAKETOSHI;MORIGA NAMIKI;SUWA TAKEHIKO |
分类号 |
H01L23/28;H01L21/56;H01L23/12;H01L23/31;H01L23/498 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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