DEVICE USING LEAD FREE SOLDER

摘要

PROBLEM TO BE SOLVED: To prevent stainless steel from being corroded by arsenic (As) which is an impurity in lead-free solder. SOLUTION: In a device intended to use lead-free solder and composed of a metallic material (SUS-stainless steel-material) that is corroded by lead-free solder 8, a nickel layer 11 is provided to the surface of the metallic material that is corroded by the lead-free solder. COPYRIGHT: (C)2005,JPO&NCIPI