发明名称 Film forming method
摘要 CVD is performed without damaging a micro-fabricated semiconductor element. An organic material gas containing amine is used as deposition material gas ( 6 ). The material gas ( 6 ) is introduced into a vacuum chamber ( 3 ) and ultraviolet light radiated from each of lamps ( 2 ) is applied onto an object ( 5 ) to be processed placed in the chamber ( 3 ), thereby causing chemical vapor deposition to be carried out, whereby a film is grown at a temperature that no damage is given to a semiconductor element or the like of the object ( 5 ).
申请公布号 US2005118834(A1) 申请公布日期 2005.06.02
申请号 US20040844543 申请日期 2004.05.13
申请人 TOSHIKAWA KIYOHIKO;MIYANO JUNICHI 发明人 TOSHIKAWA KIYOHIKO;MIYANO JUNICHI
分类号 C23C16/02;C23C16/34;C23C16/48;H01L21/312;H01L21/318;H01L21/768;(IPC1-7):H01L21/31;H01L21/469 主分类号 C23C16/02
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