发明名称 |
Film forming method |
摘要 |
CVD is performed without damaging a micro-fabricated semiconductor element. An organic material gas containing amine is used as deposition material gas ( 6 ). The material gas ( 6 ) is introduced into a vacuum chamber ( 3 ) and ultraviolet light radiated from each of lamps ( 2 ) is applied onto an object ( 5 ) to be processed placed in the chamber ( 3 ), thereby causing chemical vapor deposition to be carried out, whereby a film is grown at a temperature that no damage is given to a semiconductor element or the like of the object ( 5 ).
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申请公布号 |
US2005118834(A1) |
申请公布日期 |
2005.06.02 |
申请号 |
US20040844543 |
申请日期 |
2004.05.13 |
申请人 |
TOSHIKAWA KIYOHIKO;MIYANO JUNICHI |
发明人 |
TOSHIKAWA KIYOHIKO;MIYANO JUNICHI |
分类号 |
C23C16/02;C23C16/34;C23C16/48;H01L21/312;H01L21/318;H01L21/768;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
C23C16/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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