| 发明名称 |
Sputtering cathode and device and method for coating a substrate with several layers |
| 摘要 |
The invention relates to a sputtering cathode ( 1 ) for coating a substrate ( 6 ), which comprises a device ( 5 ) for generating an external magnetic field with substantially parallel magnetic field lines ( 8 ) substantially in the plane of the substrate. The invention further relates to a device and a method for coating a substrate with several layers, whereby several sputtering cathodes are disposed in a circle with their target effective areas pointing radially outward.
|
| 申请公布号 |
US2005115822(A1) |
申请公布日期 |
2005.06.02 |
| 申请号 |
US20040504200 |
申请日期 |
2004.09.20 |
| 申请人 |
MAASS WOLFRAM;SCHNEIDER ROLAND;MUHLFELD UWE;MUNDORF CHRISTOPH;OCKER BERTHOLD;LANGER JURGEN;SCHNEIDER DIETMER;JOHN HELMUT;SPIELVOGEL RUDI;CLAUSSEN ERIC;STERN WOLFGANG;LAUSMANN HELMUT;LANDMANN MATTHIAS;SOMMERFELD REINHARD |
发明人 |
MAASS WOLFRAM;SCHNEIDER ROLAND;MUHLFELD UWE;MUNDORF CHRISTOPH;OCKER BERTHOLD;LANGER JURGEN;SCHNEIDER DIETMER;JOHN HELMUT;SPIELVOGEL RUDI;CLAUSSEN ERIC;STERN WOLFGANG;LAUSMANN HELMUT;LANDMANN MATTHIAS;SOMMERFELD REINHARD |
| 分类号 |
H05H1/46;C23C14/35;H01F41/18;H01J37/34;H01L21/8246;H01L27/105;H01L43/08;H01L43/12;(IPC1-7):C23C14/32 |
主分类号 |
H05H1/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
