LAND GRID ARRAY PACKAGE

摘要

A land grid array package having a structure wherein a device-side ground electrode (6) and a substrate-side ground electrode (9), and a device-side peripheral electrode (7) and a substrate-side peripheral electrode (10) are respectively soldered with an eutectic solder (16) is characterized in that a gas vent through hole (15) penetrating a mounting substrate (3) is formed in a soldering region (18) of the device-side ground electrode (6). In this land grid array package, short circuit and disconnection can be suppressed.