发明名称 STACKED MEMORY, MEMORY MODULE, AND MEMORY SYSTEM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a memory module of a 4 rank configuration which can perform high-speed transmission of a data signal without deteriorating signal quality, can provide transmission characteristics of signal wiring of various control signals, and is advantageous for lowering power consumption. <P>SOLUTION: A memory module is provided with a point to point bus and a daisy chain bus for supplying a signal to a stacked memory and a stacked memory having at least a space of one of this stacked memory is mounted on one face and face of another side respectively. Moreover, the memory module is configured so that a memory chip comprising a stacked memory mounted on one face of module substrate and a memory chip comprising a stacked memory mounted on a face of the other side of the module substrate are set active by turns and simultaneously. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005141829(A) 申请公布日期 2005.06.02
申请号 JP20030376852 申请日期 2003.11.06
申请人 ELPIDA MEMORY INC 发明人 SENBA SEIJI;NISHIO YOJI
分类号 G06F12/00;G06F13/16;G11C5/00;G11C5/04;G11C11/401;H01L25/065;H01L25/10;H01L27/10;H05K1/18;(IPC1-7):G11C5/00 主分类号 G06F12/00
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