| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of vacuum depositing an MEI (Electromagnetic Interference) layer using a vacuum deposition jig for a mobile phone outer case where safety is high, an inferiority ratio is reduced, and cost effectiveness is high as well. SOLUTION: Regarding the method of vacuum depositing an EMI layer using a vacuum deposition jig for a mobile phone outer case, the method of fabricating an EMI layer in a mobile phone outer case comprises: a stage wherein jigs are formed at the upper and lower parts; a stage wherein a mobile phone outer case is fixed into the jigs and a vacuum deposition method is performed; and a stage wherein an EMI layer is formed only at the part which is not coated with the jigs. COPYRIGHT: (C)2005,JPO&NCIPI |
