发明名称 TESTER FOR MULTI-WAVELENGTH LASER DIODE PACKAGE
摘要 PROBLEM TO BE SOLVED: To effectively shorten time required for testing a multi-wavelength LD package to be tested. SOLUTION: Current drive circuits or current drive control circuits are provided respectively corresponding to a plurality of LD chips included in the multi-wavelength LD package. Wavelength laser light emitted from the LD chips activated by currents from these current drive circuits or the current drive control circuits are separated into each of wavelength components via a branching means. Light outputs of the separated wavelength components are detected by respective light emitting elements. Operating characteristics of the plurality n of the LD chips in the multi-wavelength LD package are simultaneously tested on the basis of the light output detection values of the wavelength components. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005142184(A) 申请公布日期 2005.06.02
申请号 JP20030373954 申请日期 2003.11.04
申请人 DAITRON TECHNOLOGY CO LTD 发明人 IGAWA KATSUHIKO
分类号 H01S5/062;H01S5/022;(IPC1-7):H01S5/062 主分类号 H01S5/062
代理机构 代理人
主权项
地址