| 摘要 |
PROBLEM TO BE SOLVED: To provide a memory module having an improved register arrangement structure. SOLUTION: This memory module is used for mounting memory chips on its front surface and its back surface, and provided with a first register pair and a second register pair. The first register pair is disposed in the center of the memory module, and disposed in a position where the front and back surfaces of the memory module face each other. The second register pair is disposed adjacently to the first register pair, and disposed in a position where the front and back surfaces of the memory module face each other. The first register pair serially transfers a received signal to the second register pair without branching it. The first register pair and the second register pair are arranged by being shifted in the height direction, one outputted signal is applied to the memory chip positioned on the left side of the first register pair or the second register pair, and the other signal is applied to the memory chip positioned on the right side of the first register pair or the second register pair. COPYRIGHT: (C)2005,JPO&NCIPI
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