| 发明名称 |
Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers |
| 摘要 |
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect. |
| 申请公布号 |
US2005116013(A1) |
申请公布日期 |
2005.06.02 |
| 申请号 |
US20030722432 |
申请日期 |
2003.11.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KWARK YOUNG H.;SCHUSTER CHRISTIAN |
| 分类号 |
H01L23/66;H05K1/02;(IPC1-7):B23K31/02 |
主分类号 |
H01L23/66 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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