RESIN COMPOSITION, RESIN VARNISH, HEAT-RESISTANT ADHESIVE, HEAT-RESISTANT ADHESIVE MATERIAL USING THE ADHESIVE, LEAD-FRAME WITH THE ADHESIVE MATERIAL, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition, resin varnish, heat-resistant adhesive, heat-resistant adhesive material using the adhesive, and lead-frame with the adhesive material that can be bonded at a low temperature and is excellent in heat resistance, compared with those by conventional techniques, and a semiconductor device.

SOLUTION: This resin composition comprises a polymer having a structure unit represented by formula (I) wherein n is an integer of 3-7; Y is a group represented by formula (II); and Y's in the structure units may be different from each other.

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