摘要 |
The invention provides a method for injection molding a wall covering comprising a plurality of panels, the method comprising the steps of: (a) providing a mold having a mold cavity therein, the mold cavity defining a wall covering comprising a plurality of panels, (b) providing a first precursor, the first precursor comprising a thermoplastic resin, (c) providing a second precursor, the second precursor comprising a thermoplastic resin and a filler, (d) mixing the first and second precursors in a controlled ratio to produce a precursor mixture, (e) melting the precursor mixture to produce a melted precursor mixture, (f) injecting the melted precursor mixture into the mold cavity, (g) cooling the melted precursor mixture contained in the mold cavity to a temperature sufficient for the melted precursor mixture to at least partially set and form the wall covering, and (h) releasing the wall covering from the mold.
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