发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus by which a processing liquid is applied stably and which is miniaturized, and to provide a substrate processing method by which the processing liquid is applied stably. SOLUTION: A vertical carrying unit 7 and a resist application treatment unit CT are arranged with an interval h therebetween. Thus, the application treatment of a resist to a glass substrate G is prevented from becoming unstable due to the vibration of the vertical carrying unit 7. Surrounding the carrying unit 7, the resist application processing unit CT and reduced-pressure drying units 53b and 55b are arranged. Thus, the carrying unit 7, the reduced-pressure drying units 53b and 55b and the resist application processing unit CT are prevented from being arranged side by side in one direction, thereby miniaturizing an application development processing apparatus 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005142372(A) 申请公布日期 2005.06.02
申请号 JP20030377532 申请日期 2003.11.06
申请人 TOKYO ELECTRON LTD 发明人 SAKAI MITSUHIRO;KAERIYAMA TAKEO
分类号 B65G49/00;B65G49/06;G02F1/13;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):H01L21/027 主分类号 B65G49/00
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