| 摘要 |
PROBLEM TO BE SOLVED: To provide multiple pins of a chip lamination type semiconductor device. SOLUTION: The semiconductor device is formed of an SIP substrate in which a plurality of bonding pads and flip chip electrodes are provided on the main surface 1a and a plurality of bump lands 1c are formed on the rear surface 1b, a microcomputer chip which is flip-chip connected to the SIP substrate, a memory chip laminated on the microcomputer chip and the other chips, a plurality of wires for connecting the memory chips and the SIP substrate and also connecting the other memory chips and the SIP substrate, a sealing material for resin-sealing of three semiconductor chips, and solder balls mounted to the bump lands 1c. The plating film of nickel-gold alloy is formed on the respective surfaces of the bonding pad and bump lands 1c. Moreover, an electrolytically plated wire 1h for power feeding for connection with the plated film is formed at the internal layer of the SIP substrate. COPYRIGHT: (C)2005,JPO&NCIPI
|
