| 摘要 |
PROBLEM TO BE SOLVED: To improve sealing reliability when welding and hermetically sealing a ceramic base and a metal cap formed with a soldering material. SOLUTION: A package for an electronic component is hermetically sealed by soldering the ceramic base 1 which houses an electronic component element inside and is formed with a metallized layer 11d in the outer periphery of the top face, and the metallic cap 2 placed on top of the metallized layer of the base. The cap consists of at least two layers including a metal base material layer and a soldering material layer, and is formed with a dam 21a which is formed as a result of the overhanging of the metal base material to the soldering material layer side at the edge of the periphery thereof. COPYRIGHT: (C)2005,JPO&NCIPI
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