发明名称 |
METHOD OF FORMING PATTERN, METHOD OF MANUFACTURING ELECTROOPTIC DEVICE, METHOD OF MANUFACTURING DEVICE, AND ELECTRONIC EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming pattern by which a conductive pattern formed by arranging conductive films on a patterned first film can be formed through a more simple process. SOLUTION: After the first film 41 is formed on a substrate 40, a liquid repellent film 42 is formed on the first film 41 in a pattern. Then catalyst films 43 are formed in areas in which the liquid repellent film 42 is not formed and the conductive films 609 are selectively formed on the catalyst films 43 by electroless plating. Finally, the first film 41 is patterned by using the conductive films 609 as masks. COPYRIGHT: (C)2005,JPO&NCIPI
|
申请公布号 |
JP2005142277(A) |
申请公布日期 |
2005.06.02 |
申请号 |
JP20030375588 |
申请日期 |
2003.11.05 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HASHI YUKIHIRO |
分类号 |
H05B33/10;G09F9/30;H01L21/288;H01L21/3205;H01L21/768;H01L51/50;H05B33/12;H05B33/14;H05B33/22;(IPC1-7):H01L21/320 |
主分类号 |
H05B33/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|