发明名称 METHOD OF FORMING PATTERN, METHOD OF MANUFACTURING ELECTROOPTIC DEVICE, METHOD OF MANUFACTURING DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of forming pattern by which a conductive pattern formed by arranging conductive films on a patterned first film can be formed through a more simple process. SOLUTION: After the first film 41 is formed on a substrate 40, a liquid repellent film 42 is formed on the first film 41 in a pattern. Then catalyst films 43 are formed in areas in which the liquid repellent film 42 is not formed and the conductive films 609 are selectively formed on the catalyst films 43 by electroless plating. Finally, the first film 41 is patterned by using the conductive films 609 as masks. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005142277(A) 申请公布日期 2005.06.02
申请号 JP20030375588 申请日期 2003.11.05
申请人 SEIKO EPSON CORP 发明人 HASHI YUKIHIRO
分类号 H05B33/10;G09F9/30;H01L21/288;H01L21/3205;H01L21/768;H01L51/50;H05B33/12;H05B33/14;H05B33/22;(IPC1-7):H01L21/320 主分类号 H05B33/10
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