MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact

摘要

A MOS device has: a semiconductor body defining a surface; a stack on top of the semiconductor body; and a passivation layer on top of the semiconductor body and covering the stack. The stack is formed by a first polysilicon region and by a second polysilicon region arranged on top of one another and separated by an intermediate dielectric region. An electrical connection region extends through the passivation layer as far as the surface of the semiconductor body laterally with respect to, and in contact with, the first and the second polysilicon regions so as to contact them electrically.