| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a tape carrier for TAB which can be improved in dimensional accuracy and positional accuracy at transporting, mounting, and bonding and, in addition, with which high-density wiring can be realized while the weight and thickness of the carrier are reduced. SOLUTION: An insulating layer 2 is formed on a reinforcing layer 4 composed of stainless steel foil. Then, after a base 16 composed of a thin conductor film is formed on the insulating layer 2; a plurality of feed holes 15 are formed through both end edges of the reinforcing layer 4, insulating layer 2, and base 16 in the widthwise direction at intervals along the longitudinal direction of the insulating layer 2. In addition, a plating resist 17 is formed on the base 16, and a conductor pattern 7 is formed by plating. Thereafter, the plating resist 17 and the base 16 are removed. Moreover, the reinforcing layer 4 is removed so that the layer 4 may be left along the lengthwise direction of the insulating film 2 on both end edges of the rear surface of the layer 2 in the widthwise direction. COPYRIGHT: (C)2005,JPO&NCIPI
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